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friction performance of sicp cu hybrid materials with compound additive yunlong zhang wei zhou haifeng zhang and qingxiang yang anyang institute of technology huang he street anyang city p r ...

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                           Friction Performance of SiCp/Cu Hybrid Materials with Compound 
                                                                                           Additive  
                                                                                            *                                                        
                                                    Yunlong Zhang, Wei Zhou , Haifeng Zhang and Qingxiang Yang
                                                        Anyang institute of technology, Huang he street, Anyang city, P. R. China 
                         Keywords:          Cu matrix hybrid material, Rare earth oxides, Coefficient of friction 
                         Abstract:          Copper alloy material had excellent electrical and thermal characteristics, but its poor wear resistance and low 
                                            hardness limited its wider application. So it was necessary to improve wear resistance of copper alloy. In this 
                                            paper,  compound  additives  La O /Al O /CeO   were  introduced  into  SiCp/Cu  composites  and  hot-press 
                                                                                   2  3    2  3      2
                                            sintering method was executed to synthesize SiCp/Cu composites. The influence of rare earth oxides on the 
                                            phase constitution, micro structure and coefficient of friction of SiCp/Cu composites were investigated. 
                         1      INTRODUCTION                                                            of  silicon  carbide  and  prepared  by  mechanical 
                                                                                                        alloying  in  the  high  energy  planetary  mill 
                         Metal  composites  were  developed  into  prime                                (Prosviryakov,  2013).  However,  the  reports  about 
                         candidate  as  functional  materials.  Metal-ceramics                          addition of rare earth oxides to SiC/Cu composites 
                         composites exhibited superior performance such as                              were        relatively        scarce.        In      this      work, 
                                                                                                        La O /Al O /CeO were  introduced  into  SiC /Cu 
                         high specific strength, high elastic modulus and wear                             2   3    2   3       2                                        p
                         resistance. Copper alloy were utilized as functional                           composite.  The  density,  phase  constitution,  micro 
                                                                                                        structure  and  coefficient  of  friction  of  SiC /Cu 
                         materials  with  high  thermal  electrical  properties                                                                                          p
                         (Wang,  2011).  However,  the  poor  wear  resistance                          composites were investigated.  
                         limited wider engineering application. Some ceramic 
                         particles were used as reinforcement, such as metal                            2     EXPERIMENTAL PROCESS 
                         carbides (WC, SiC, TiC), metal nitrides (TiN, Si N ), 
                                                                                          3  4
                         metal  borides  (ZrB ,  WB,  TiB )  and  metal  oxides 
                                                    2               2
                         (Al O , ZrO ). SiC particles were utilized in the Cu 
                              2  3        2                                                             The initial materials were domestic copper powders 
                         matrix considering the special properties of SiC  on 
                                                                                           p            (D =38µm),  SiC  powder  (D =38.5µm),  Al O  
                         account of high hardness, good wear, low density                                  50                                       50                    2   3
                                                                                                        powders         (D =0.5µm)            and      La O         powders 
                         (Dhokey,  2008).  So  SiC /Cu  composites  were                                                   50                              2  3
                                                              p                                         (D =0.5µm).  The  initial  powders  were  mixed  in 
                         developed  as  functional  material  due  to  their                               50
                                                                                                        accordance with the composition ratio designed in 
                         excellent  electrical  and  thermal  conductivity,  good                       Table 1 in which mass ratio of Al O  and La O  was 
                         wear  resistance  (Zhang,  2008).  At  present,  more                                                                       2   3          2   3
                                                                                                        1:3.  The  content  of  CeO2  was  about  2wt.%.  For 
                         reports on SiC /Cu composites were widespread (Zhu, 
                                            p                                                           comparison  specimen  S5  without  compound 
                         2007).  Copper-based  composites  reinforced  with                             additives was also studied. The initial powders were 
                         15-35wt.%  SiC  were  fabricated  by  mechanical                               mixed  by  ball-milling  machine.  The  milling  was 
                         alloying,  so  an  increase  in  milling  time  and  SiC                       320rpm for 8h. Before sintering process, the mixture 
                         content (up to 25 wt.%) lead to a higher hardness of                           was cold pressed into a cylindrical compact in a die of 
                         Cu  matrix  materials  due  to  homogenization  of                             40mm in diameter with pressure of 200MPa. SiC /Cu 
                         microstructure         and  refinement  of  reinforcing                                                                                         p
                                                                                                        composites were sintered in a graphite die at 840℃ 
                         particles (Perumal, 2015). The effect of SiC content                           for 1h in hot-press sinter furnace with argon gas and 
                         and  particle  size  on  the  density,  hardness  and                          heating rate  was  about  30℃/min.  Density  measure 
                         electrical  conductivity  were  investigated  (Peng,                           was carried out according to Archimedes principle. 
                         2012). The structure and particle size of copper based                         Microstructure of  composites was observed by SEM. 
                         composite reinforced with a high content (15-35wt%)                            Phases constitution were analysized by X-ray(Bruker 
                                                                                                                                                                            93
                         Zhang, Y., Zhou, W., Zhang, H. and Yang, Q.
                         Friction Performance of SiCp/Cu Hybrid Materials with Compound Additive.
                         DOI: 10.5220/0008186100930096
                         In The Second International Conference on Materials Chemistry and Environmental Protection (MEEP 2018), pages 93-96
                         ISBN: 978-989-758-360-5
                                  c
                         Copyright 
 2019 by SCITEPRESS – Science and Technology Publications, Lda. All rights reserved
                                         
                                  MEEP2018-TheSecondInternationalConferenceonMaterials Chemistry and Environmental Protection
                                  D8, Germany). The coefficient of friction of SiC /Cu                                                            Figure 2 revealed density of SiCp/Cu composites 
                                                                                                                         p
                                  composites were measured by SFT-2M type pin plate                                                         with different content of compound additive. From 
                                  friction and wear tester. The friction pair was GCr15                                                     the  data  of  the  density,  the  density  varied  from 
                                                                                                                                                                       3
                                  steel balls with a diameter of 6mm. Test parameters:                                                      5.73~6.05g/cm .  As  the  total  content  of  the 
                                  linear velocity is 200r/min, rotation radius was 3mm,                                                     compound additive was beyond 8%, ( La O > 4.5%), 
                                                                                                                                                                                                                      2   3 
                                  the  load  was  200g  and  the  friction  time  was  600                                                  the density  reduced due to  more porosity and defects. 
                                  seconds.  S1,  S2,  S3,  S4  represented  SiC /Cu                                                         The density variation was not distinct. For improving 
                                                                                                                         p
                                  composites with different compound additive and S5                                                        the density, too high or low additive was unsuitable. 
                                  represented SiC /Cu composites without compound                                                           Especially when La O content was about 4.5%, the 
                                                               p                                                                                                                2    3 
                                  additive after friction experiment.                                                                       density was higher.                                   
                                                                                                                                                          6.4
                                         Table 1: Designation of SiCp/Cu materials (wt.%)                                                                 6.3
                                      Designation              Cu          SiC        La O           Al O           CeO                                   6.2
                                                                                           2   3         2   3             2
                                              S1             75.2         18.8            3              1             2                                ) 6.1
                                                                                                                                                      3 m
                                                                                                                                                        /c6.0
                                              S2             73.6         18.4           4.5           1.5             2                                g
                                                                                                                                                        ity (5.9                                                                          
                                                                                                                                                        s
                                              S3               72           18            6              2             2                                n
                                                                                                                                                        e 5.8
                                              S4             70.4         17.6           7.5           2.5             2                                D
                                                                                                                                                          5.7
                                              S5               80           20            0              0             0                                  5.6
                                                                                                                                                          5.5
                                                                                                                                                            2.5   3.0    3.5   4.0    4.5    5.0   5.5    6.0   6.5    7.0   7.5    8.0
                                                                                                                                                                                        La O  content (%)
                                                                                                                                                                                           2  3                                          
                                  3        RESULTS AND DISCUSSION                                                                           Figure  2:  Density  of  SiC /Cu  composites  with  different 
                                                                                                                                                                                       p
                                                                                                                                            content of compound additive. 
                                                                                                    Copper
                                                                                                    SiC                                           The microstructure of SiC /Cu composites with 
                                                                                                  × La O                                                                                           p
                                                                                                       2 3                                  different content of compound additive was listed in 
                                                                                                                                            Figure 3 a), b), c) and d) represented S1, S2, S3, S4 
                                                 )
                                                 .                                                                                          for  SiC /Cu  composites  with  different  compound 
                                                 u                                                                                                        p
                                                 .  S5
                                                 a
                                                 (                                                                      
                                                  
                                                 y                                                                                          additive. White particles were SiC  and grey part was 
                                                 t          ×       ×        ×                                                                                                                           p
                                                 i
                                                 s  S4
                                                 n
                                                 e
                                                 t  S3                                                                                      Cu matrix. Moreover, Cu matrix was continuous and 
                                                 n
                                                 I                                                                                          no  obvious  hole  appeared.  It  was  difficult  to 
                                                    S2
                                                    S1                                                                                      distinguish distribution variation of SiC  in the Cu 
                                                                                                                                                                                                                      p
                                                  30        40        50        60       70        80        90                             matrix, considering that proportion of SiC introduced 
                                                                          Diffraction angle (2-theta)                                       in the composition does not change significantly. 
                                  Figure  1:  XRD  pattern  of  SiC /Cu  composites  with                                                         Figure 4 showed high magnification SEM photos 
                                  different compound additive.                             p                                                of S2 and S5 specimen. As the compound additives 
                                                                                                                                            were  introduced  into  the  SiC /Cu  composites,  the 
                                                                                                                                                                                                    p
                                  XRD pattern of SiC /Cu composites with different                                                          interface was more clear and more tightly integrated 
                                                                        p                                                                   between SiC and Cu matrix (shown in Figure 4a) As a 
                                  compound additive was showed in Figure 1, Cu and                                                          contrast, more defects and holes were found on the 
                                  SiC peaks were detected as main phase, and La O  
                                                                                                                           2    3           interface  between  SiC  and  copper  of  SiC /Cu 
                                  was formed as trace phase. Other phase such as Al O                                                                                                                                              p
                                                                                                                           2    3           composites  without  compound  additive.  So  the 
                                  and CeO was not found in the SiC /Cu composites. 
                                                  2                                                p                                        introduction of composite additives with appropriate 
                                  The  intensity  of  diffraction  peaks  of  SiC  and  Cu                                                  content  can  improve  interfacial  adhesion  between 
                                  phase was not obvious even if compound additive                                                           SiC  and  copper  matrix.  The  SiC  particle  were 
                                  content was different. Copper was main crystal phase                                                      distributed  uniformly  in  the  Cu  matrix  (shown  in 
                                  and its diffraction peak corresponds to the standard                                                      Figure  4c)  For  all  experimental  specimens,  SiC 
                                  card  of  copper  synthesis  (JCPDS  04-0836).  The                                                       particles was distributed uniformly in the Cu matrix. 
                                  diffraction  peak  of  6H-SiC  standard  card  (JCPDS 
                                  29-1131). The intensity of diffraction peaks of La O
                                                                                                                           2    3 
                                  phase increased as the content of compound additive 
                                  content was higher. 
                                  94
                     
                                                                           Friction Performance of SiCp/Cu Hybrid Materials with Compound Additive
                      a)                                                              a) 
                                                                                                                    interface 
                                                                
                      b)                                                                                                               
                                                                                     
                                                                                      b) 
                                                                                                            interface 
                                                                
                      c) 
                                                                                                                                       
                                                                                      c) 
                                                                
                      d) 
                                                                                                                                       
                                                                                    Figure 4: High magnification SEM photos of S2, S5 and S4 
                                                                                    specimen. a), b)  and c) represented S2,S5 and S4. 
                                                                                        Figure 5 showed friction coefficient of SiC/Cu 
                    Figure  3:  Microstructure  of  SiC /Cu  composites  with 
                                                       p                            materials  with  different  content  of  compound 
                    different content of compound additive. a), b), c) and d)       additive. As a comparison, friction coefficient of S5 
                    represented S1, S2, S3, S4.                                     was about 0.6~0.7. In comparison, friction coefficient 
                                                                                    of  SiC/Cu  materials  decreased  significantly  when 
                                                                                    compound  additive  was  introduced  into  SiC/Cu 
                                                                                    materials. For four different SiC/Cu hybrid materials, 
                                                                                    friction   coefficient  varied  between  0.08~0.18. 
                                                                                    Especially,  when  content  of  additive  La O   was 
                                                                                                                                    2  3
                                                                                    4.5%, its  friction  coefficient  was  about  0.07~0.09. 
                                                                                                                                           95
                            
                      MEEP2018-TheSecondInternationalConferenceonMaterials Chemistry and Environmental Protection
                      The  friction  coefficient  of  SiC/Cu  composites                   Simulation  Design  and  Airborne  Equipment  of 
                      without compound additive was high. The addition of                  Anyang City. 
                      compound additive played an important role, so it 
                      effectively relieved plastic deformation of Cu matrix 
                      during  the  friction  process  and  improved  wear                  REFERENCES 
                      resistance, thus the abrasion resistance improved. 
                                                        
                           1.0                                                             Dhokey,  N.B.,  2008.  Study  of  wear  mechanisms  in 
                           0.9                                                                  copper-based  SiCp  reinforced  composite  [J].Wear, 
                           0.8  S5                                                              (265): 117-133. 
                          n                                                                Peng,  J.,  2012.  The  effect  of  SiC  particle  size  on  the 
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                                S2                                                         Prosviryakov, A.S., 2013. Mechanical alloying of Cu–SiC 
                           0.2  S1                                                              materials  prepared  with  utilisation  of  copper  waste 
                           0.1 S3                                                               chips[J], Powder Metall. 54: 382–384. 
                               S4                                                          Wang,  C.  C.,  2011.  Thermal  Conducting  Property  of 
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                                                  Time ( s)                                     SiCp-reinforced  Cu  Matrix  Composites  by  Hot 
                                                                                                Pressing [J]. J. Compos. Mater.,45(18):1849–1852 
                      Figure  5:  Friction  coefficient  of  SiC/Cu  materials  with       Zhang,  L.,  2008.  Thermo-physical  and  Mechanical 
                      different content of compound additive.                                   Properties  of  High  Volume  Fraction  SiCp/Cu 
                                                                                                Composites Prepared by Pressureless Infiltration [J]. 
                                                                                                Materials Science and Engineering A, 489: 285–293 
                                                                                           Zhu,  L.,  2007.  Microstructure  and  performance  of 
                      4     CONCLUSIONS                                                         electroformed  Cu/nano-SiC  composite  [J].  Mater. 
                                                                                                Design, (28): 1958-1962. 
                      SiC /Cu  composites  were  fabricated  by  hot-press 
                           p
                      sinter  method.  The  introduction  of  compound 
                      additive  played  an  important  role  on  the  friction 
                      coefficient. Micron SiC  were distributed uniformly 
                                                   p
                      in  the  Cu matrix. Compared with SiC /Cu without 
                                                                     p
                      compound additive, friction coefficient of SiC /Cu 
                                                                               p
                      materials  with  compound  additive  was  low,  so  it 
                      meant  that  SiC /Cu  materials  with  moderate 
                                            p
                      compound additive had better wear resistance. 
                      ACKNOWLEDGEMENTS 
                      Authors  thank  for  fund  support  by  science  and 
                      technology  research  projects  from  Anyang  city  ( 
                      project " thermal conductivity behavior research of 
                      copper        matrix       hybrid        materials       with 
                      wear-resisting/low  expansion  for  aviation  electric 
                      contact     field”),scientific     research     projects    in 
                      education       department        of    Henan       province 
                      (No.18A430006), Higher education teaching reform 
                      research and practice project for Henan Province (No. 
                      2017SJGLX117), the scientific research project from 
                      Anyang institute  of  technology  (No.  BSJ2017007, 
                      BSJ2018018).  Meanwhile, Part of the data in this 
                      paper was provided by Key laboratory of Aerocraft 
                      96
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...Friction performance of sicp cu hybrid materials with compound additive yunlong zhang wei zhou haifeng and qingxiang yang anyang institute technology huang he street city p r china keywords matrix material rare earth oxides coefficient abstract copper alloy had excellent electrical thermal characteristics but its poor wear resistance low hardness limited wider application so it was necessary to improve in this paper additives la o al ceo were introduced into composites hot press sintering method executed synthesize the influence on phase constitution micro structure investigated introduction silicon carbide prepared by mechanical alloying high energy planetary mill metal developed prime prosviryakov however reports about candidate as functional ceramics addition sic exhibited superior such relatively scarce work specific strength elastic modulus utilized composite density properties wang engineering some ceramic particles used reinforcement experimental process carbides wc tic nitrides...

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